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Interface reaction between an electroless Ni–Co–P metallizationand Sn–3.5Ag...
Interface reaction between an electroless Ni–Co–P metallizationand Sn–3.5Ag lead-free solder with improved joint reliability, Ying Yang, J. N. Balaraju, Yizhong Huang, Hai Liu, Zhong Chen, Acta Materialia, 71 (2014) 69-79, doi: 10.1016/j.actamat.2014.02.026